On April 19, the School of Engineering at Eastern International University (EIU) hosted a seminar “Introduction on Semiconductor Packaging”. The event featured Professor Andrew Tay, Director of the Region 10 Asia & Pacific program at the Singapore Hybrid-Integrated Next-Generation μ-Electronics (SHINE), National University of Singapore. Dr. Nguyễn Xuân Hùng, Vice Dean of the school, alongside faculty, staff, and students of the School of Engineering, attended the seminar.
Professor Andrew Tay at the seminar
In addition to semiconductor chip design and fabrication, semiconductor packaging plays a crucial role in ensuring the stable and efficient operation of chips. Professor Tay provided an overview of the techniques and technologies involved in the semiconductor packaging process. With his extensive experience, he outlined the steps in the packaging process, focusing on the important chemical and physical properties necessary for designing and manufacturing semiconductor packages. He also proposed a direction for specialised training in this field, building on the existing mechanical and materials engineering foundations of the School of Engineering.
Faculty member asked a question to Professor Andrew Tay
Furthermore, Professor Tay discussed the prospects of the semiconductor packaging sector within the global semiconductor industry’s value chain. The seminar marked an important first step in affirming EIU and Becamex’s commitment to training and providing high-quality human resources to meet the workforce demands of the semiconductor industry, a field with significant potential in Vietnam and the region in the near future.
Some images from the program
