On July 14, Eastern International University (EIU) hosted a seminar titled “Advanced Substrates for Chiplets and Heterogeneous Integrated Packaging”, which attracted a large number of faculty members, staff, and students.
Dr. Nguyễn Xuân Hùng – Vice Dean of the School of Engineering, Head of EIU FabLab – speaks at the seminar
During the program, Dr. John H. Lau, a leading expert from Unimicron Technology Corporation, provided EIU faculty and students with a comprehensive perspective on advanced packaging technologies for chiplets. In his presentation, he emphasized the role of chiplets as a breakthrough solution that allows the separation of complex functions into individual modules, which are manufactured independently and then precisely integrated using modern packaging techniques to achieve superior performance and greater customization.
Dr. John H. Lau engaging with faculty, staff, and students
On this occasion, Mr. Khánh Vũ – Chair of the IEEE Electronics Packaging Society (EPS) Vietnam Chapter gave an overview of the Chapter’s activities since its establishment on June 23, 2023.
Dr. John H. Lau also introduced methods for heterogeneous integration, which involves combining different types of microcircuit components, technologies, and materials into a single packaging substrate. This solution not only optimizes system performance and shortens time-to-market, but also significantly reduces production costs. It opens up a wide range of applications in advanced technologies such as artificial intelligence and next-generation mobile devices.
Faculty member from the Faculty of Engineering raises a question for the speaker
The seminar served as a valuable opportunity for EIU’s faculty, staff, and students to gain in-depth knowledge and stay updated on the latest trends in the semiconductor industry. It also provided a professional networking platform to connect with leading experts in the field. With the support and collaboration of IEEE, IEEE Electronics Packaging Society, Intel, and Onsemi, the event reaffirmed its practical value and significance in enhancing the university’s academic and training efforts./.
